Introduction of Aluminum PCB Print Circuit Board:
Among all Metal core PCBs, Aluminum PCB is the most common type. The base material consists of an aluminum core and standard FR4. It features a thermal clad layer that dissipates heat in a highly efficient manner while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCB is regarded as the solution to high power and tight tolerance applications.
Advantages of Aluminum PCB Print Circuit Board:
1.Environmentally Friendly: Aluminum is non-toxic and recyclable. Manufacturing with aluminum is also conducive to conserving energy due to its ease of assembly. For printed circuit board suppliers, using this metal helps maintain the health of our planet.
2.Heat dissipation: High temperatures can cause severe damage to electronics, so it is wise to use a material that can help dissipate heat. Aluminum can actually transfer heat away from vital components, thus minimizing the harmful effect it could have on the circuit board.
3.Higher durability: Aluminum provides strength and durability to a product that ceramic or fiberglass bases cannot. Aluminum is a sturdy base material that can reduce accidental breakage during manufacturing, handling, and everyday use.
4.Lightweight: For its incredible durability, aluminum is a surprisingly lightweight metal. Aluminum adds strength and resilience without adding on any additional weight.
| 1.Base Material | FR-4 /Aluminum /CEM-1 |
| 2.Layers | 1-40 |
| 3.Finised inner/outer copper thickness | 1-6OZ |
| 4.Finished board thickness | 0.2-7.0mm |
| 5.Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
| 6.Controlled Impedance | +/-5% |
| 7.Plugging vias capability | 0.2-0.8mm |
| 8.Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
| 9.Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OPS... |
Structure of Aluminum PCB Print Circuit Board:
1. Circuit Copper Layer
The circuit copper layer (usually using electrolytic copper foil) is etched to form a printed circuit, which is used to realize the assembly and connection of the device. Compared with the traditional FR-4, with the same thickness and the same line width, the aluminum substrate can carry a higher current.
2. Insulating Layer
The insulating layer is the core technology of the aluminum substrate, which mainly plays the functions of bonding, insulation and heat conduction. The aluminum substrate insulating layer is the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulating layer, the more favorable it is to spread the heat generated during the operation of the device, and the lower the operating temperature of the device, so as to increase the power load of the module, reduce the volume, extend the life-span, and increase the power output .
3. Metal substrate
What kind of metal is used for the insulating metal substrate depends on the comprehensive consideration of the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate.
In general, considering the conditions such as cost and technical performance, aluminum plate is an ideal choice. Available aluminum plates are 6061, 5052, 1060 and so on. If there are higher requirements for thermal conductivity, mechanical properties, electrical properties and other special properties, copper plates, stainless steel plates, iron plates and silicon steel plates can also be used.
